MIC-770 V3 Compact Fanless System with 12th/13th/14th Gen Intel® Core™ i CPU Socket (LGA 1700)

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Intel® 12th/13th/14th Gen Core™ i CPU socket-type (LGA1700) with Intel® R680E/ H610E chipset
Wide operating temperature (-20 ~ 60 °C)
2 x GigaLAN, 2 x USB 3.2 (Gen2) and 6 x USB 3.2 (Gen1); 2 x RS-232/422/485 and 4 x RS232 serial ports (Optional)
1 x 2.5″ HDD/SSD, 1 x mSATA, and 1 x NVMe M.2; 9 ~ 36 VDC input power range
IP40 dust proof for deployment in harsh environment
Supports FlexIO and iDoor technology, flexible configure additional DP, DVI, COM port, DIO, Remote switch IO
Supports Advantech i-Modules; Supports Advantech SUSIAPI and embedded software APIs
Supports Intel® vPro™/AMT and TPM technologies; Supports Advantech iBMC 1.2 remote out-of-band power management solution on WISE-DeviceOn
Support Windows 11 IoT Enterprise LTSC

See Datasheet